AMD’s X570 chipset was stacked with potent I/O, however introduced a big annoyance for patrons: it required energetic cooling. That meant a return to the times of yore when the usage of quicker and quicker reminiscence meant that motherboard chipsets—where the reminiscence controller used to reside—began to require heatsinks with followers.
This raises some questions that weren’t answered, reminiscent of precisely how all this might be wired. If the paired chipsets are wired up in parallel—that’s, every chip getting two lanes—then latency might be equal throughout the chips, however bandwidth might be restricted by the two-lane interface. (That mentioned, PCIe 5.0 x2 is functionally equal to PCIe 4.0 x4, which is what X570 hooks as much as.)
Whatever the case, each X670 and X670E are utilizing a pair of those chips, whereas B650 will get only one. That means B650 will solely have half the obtainable I/O in comparison with X670, however half of what AMD promised might be a lot for many customers. AMD’s slide says that Socket AM5 can have as much as 14 SuperSpeed USB ports, and a few of these most likely wire up on to the CPU socket, which suggests reasonably than dropping 7, you are most likely dropping simply 5 or 6.
In the stream, MSI’s Berkhout and Van Beurden additionally identified that MSI is not planning any Mini-ITX boards for Socket AM5’s launch. Between the enlarged CPU socket, the twin chipsets, and their want for giant passive heatsinks to keep away from a loud fan, Berkhout says it is unlikely we are going to see many X670 or X670E boards on ITX. Instead, Mini-ITX Socket AM5 boards will doubtless keep on with the single-chip B650.
As for why AMD would do one thing like this, properly, it is actually fairly good. Using a single chip throughout their product stack considerably simplifies logistics and planning, and slapping a pair of the chips on higher-end boards is a straightforward answer to increasing I/O. It’s simple to think about an enterprising motherboard vendor like Biostar utilizing a PCIe change to attach much more chipset cube for a specialised board with expansive I/O.