AMD remains to be on monitor to launch its next-generation Ryzen 7000 processors this fall, which implies there are engineering samples out within the wild. It appears an overclocker has taken a kind of ES chips (or even perhaps a qualification pattern, although that is much less doubtless) and ripped the built-in warmth spreader (IHS) off the Zen 4 half, exposing some fascinating particulars.
It’s not fully clear where precisely the picture originated from—the parents at TechPowerUp got here throughout it and opted to not put up a hyperlink to the source as “the person who shared this picture should most mostly likely not have done so.” That’s a very good name in our opinion, as there isn’t any have to get somebody in hassle over this form of factor.
In any occasion, we get a have a look at the underside of the uniquely designed IHS. Apparently the Zen 4 CPU survived the delidding course of and nonetheless works, as clarified within the feedback part. That was a foregone conclusion, as delidding is a fragile course of that may simply injury a processor if not carried out appropriately. Delidding instruments assist mitigate a few of the threat, however we do not know if the overclocker constructed a customized package for Zen 4 or went with a extra brute power method.
Either manner, the underbelly of the IHS maps out the twin 5nm chiplet design with a pair of CCDs and the 6nm I/O die space, marked by the seen solder factors within the picture above. If this picture is any indication, the IHS is glued to the CPU in eight completely different spots slightly than a strong seal as exists on Zen 3/3+.
The different fascinating factor to notice is the proximity of the CPU dies to the sting of the IHS. In idea that would have an effect on cooling. That may additionally maybe be why the warmth spreader seems to be so thick, assuming that such a design would work within the CPU’s favor, versus a thinner IHS to permit warmth to be transferred to the cooler a bit faster. Or it may merely be to take care of a sure Z-height to make sure compatibility with current fashions.
Zen 4 will introduce a brand new AM5 socket and a swap to a Land Grid Array (LGA) design like Intel has been utilizing for a very long time. This means the pins will probably be within the precise socket and never on the underside of the CPU. We additionally know that Zen 4 will roll solo with DDR5 reminiscence and provide up assist for PCI Express 5.0 as nicely.
AMD has additionally confirmed that Zen 4 will serve up 1MB of L2 cache per core and hit max enhance clocks of 5GHz or larger, leading to what the corporate claims will probably be a higher than 15 % single-threaded efficiency uplift over Zen 3.
Zen 4 is slated to reach someday this fall. In the meantime, large hat tip to TPU for sharing the delidded picture.