Steve over at Gamers Nexus not too long ago received the chance to go hands-on with a delidded AMD Ryzen 7000 Desktop CPU.
AMD Ryzen 7000 CPU Delidding Reveals Gold-Plated IHS & Zen 4 CCDs With High-Quality TIM
The CPU that was delidded is a part of the Ryzen 9 household because it has two dies and we all know that the 2 CCD configuration is barely relevant to the Ryzen 9 7950X & the Ryzen 9 7900X. The chip has a complete of three dies, two of that are the aforementioned AMD Zen 4 CCDs fabricated on the 5nm course of node after which we have now the bigger die across the middle which is the IOD and that’s based mostly on a 6nm course of node. The AMD Ryzen 7000 CCD measures at a die measurement of 70mm2 in comparison with 83mm2 for Zen 3 and have a complete of 6.57 Billion transistors, a 58% improve over the Zen 3 CCD with 4.15 Billion transistors,
Scattered across the bundle are a number of SMD’s (capacitors/resistors) that often sit below the bundle substrate if we contemplate Intel’s CPUs. AMD is as a substitute that includes them on the highest layer and as such, they needed to design a brand new sort of IHS which is internally known as the Octopus. We’ve already seen the delidded IHS earlier than however now we get to see a last manufacturing chip with no lid on it to cowl these gold Zen 4 nuggets!
With that mentioned, the IHS is an fascinating element of the AMD Ryzen 7000 Desktop CPUs. The one image exhibits the association of the 8 arms which Robert Hallock ‘Director of Technical Marketing at AMD’ refers to because the ‘Octopus’. Each arm has a small software of TIM beneath it which is used to solder the IHS to the interposer. Now delidding the chip goes to be actually onerous since every arm is true subsequent to the large array of capacitors. Each Arm can be barely raised to make room for the SMDs and customers should not fear about warmth getting trapped beneath.
AMD Ryzen 7000 Desktop CPU Delidded (Image Credits: GamersNexus):
Der8auer has additionally given an announcement to Gamers Nexus concerning his upcoming delidding package for AMD Ryzen 7000 Desktop CPUs which is within the works and he additionally appears to elucidate why the brand new CPUs function gold-plated CCDs:
Regarding the gold coating, there’s the side which you can solder indium to gold with out the necessity of flux. This makes the method simpler and you do not want aggressive chemical substances in your CPU. Without the gold coating, it might theoretically additionally work to solder the silicon to copper, however it might be tougher and also you would want the flux to interrupt the oxide layers.
Der8auer to GamersNexus
The most fascinating space of the AMD Ryzen 7000 Desktop CPU IHS, apart from the arms, is the gold plated IHS which is used to extend thermal dissipation off of the CPU/IO dies and on to the IHS. The two 5nm Zen 4 CCD’s and singular 6nm IO die have liquid-metal TIM or Thermal interface materials for higher warmth conductivity and the aforementioned gold plating does assist loads with warmth dissipation. What stays to be seen is whether or not the capacitors will function silicone coating or not however from the earlier bundle shot, it sort of appears like they do.
AMD Ryzen 7000 Desktop CPU Render (With/Without IHS):
Another factor that must be identified is that every Zen 4 CCD is admittedly near the sting of the IHS which wasn’t essentially the case with earlier Zen CPUs. So not solely delidding will probably be extremely troublesome however the middle is generally the IO die which implies that cooling tools must be prepared for such chips. The AMD Ryzen 7000 Desktop CPUs launch in Fall 2022 on the AM5 platform. That’s a chip that may attain as much as 5.85GHz with as much as 230W bundle energy so each little quantity of cooling will probably be a should for overclockers and fanatics.
AMD Mainstream Desktop CPU Generations Comparison:
|AMD CPU Family||Codename||Processor Process||Processors Cores/Threads (Max)||TDPs (Max)||Platform||Platform Chipset||Memory Support||PCIe Support||Launch|
|Ryzen 1000||Summit Ridge||14nm (Zen 1)||8/16||95W||AM4||300-Series||DDR4-2677||Gen 3.0||2017|
|Ryzen 2000||Pinnacle Ridge||12nm (Zen +)||8/16||105W||AM4||400-Series||DDR4-2933||Gen 3.0||2018|
|Ryzen 3000||Matisse||7nm (Zen 2)||16/32||105W||AM4||500-Series||DDR4-3200||Gen 4.0||2019|
|Ryzen 5000||Vermeer||7nm (Zen 3)||16/32||105W||AM4||500-Series||DDR4-3200||Gen 4.0||2020|
|Ryzen 5000 3D||Warhol?||7nm (Zen 3D)||8/16||105W||AM4||500-Series||DDR4-3200||Gen 4.0||2022|
|Ryzen 7000||Raphael||5nm (Zen 4)||16/32||170W||AM5||600-Series||DDR5-5200||Gen 5.0||2022|
|Ryzen 7000 3D||Raphael||5nm (Zen 4)||16/32?||105-170W||AM5||600-Series||DDR5-5200/5600?||Gen 5.0||2023|
|Ryzen 8000||Granite Ridge||3nm (Zen 5)?||TBA||TBA||AM5||700-Series?||DDR5-5600+||Gen 5.0||2024-2025?|